Tabletop Sputtering System
| Make: | Hind High Vacuum |
| Model: | BT 300 |
| Year of purchase: | 2016 |
| Funded by: | |
| Location: | Arkavathi |
| Contact email: | fablab@cens.res.in |
| Book New Request | |
- Direct Current Magnetron Sputtering unit used for deposition of Au and Ti.
- Plasma is produced by ionization of Argon gas with a high electric field applied between electrodes (Substrate – anode & Target – cathode).
- Current range: 30-150mA
- High Vacuum Pressure:8×10 -5 mbar
- Sputtering gas used: Argon.
- Venting Gas used: Nitrogen
- Deposition of Au and Ti thin films of thickness from few nm to μm.
| Modes | Duration (hrs) |
|---|---|
| Auto | Depend on the requirements |
| Manual | (Generally, not suggested) |
| Sl. No. - Category | Fees ( in Rs/- ) + additional 18% GST |
|---|---|
| 01 - Academic Institutes | 400 (Ti); 600 (Au)/min |
| 03 - External Industry Users | 800 (Ti); 1200 (Au)/min |
| 02 - External Industry Partner | 600 (Ti); 900 (Au)/min |