Tabletop Sputtering System
Tabletop Sputtering System
Make: Hind High Vacuum
Model: BT 300
Year of purchase: 2016
Funded by:
Location: Arkavathi
Contact email: fablab@cens.res.in
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  • Direct Current Magnetron Sputtering unit used for deposition of Au and Ti.
  • Plasma is produced by ionization of Argon gas with a high electric field applied between electrodes (Substrate – anode & Target – cathode).
  • Current range: 30-150mA
  • High Vacuum Pressure:8×10 -5 mbar
  • Sputtering gas used: Argon.
  • Venting Gas used: Nitrogen
  • Deposition of Au and Ti thin films of thickness from few nm to μm.
Modes Duration (hrs)
Auto Depend on the requirements
Manual (Generally, not suggested)
Sl. No. - Category Fees ( in Rs/- ) + additional 18% GST
06 - Industry - Gold ₹2500 per deposition till 100 nm thickness
07 - Max substrate size 2cmx2cm User Charges subject to change depending on sample size and thickness
05 - Industry - Titanium ₹2000 per deposition till 200 nm
02 - Other Academia - Gold ₹1500 per deposition till 100 nm thickness
04 - Industry partner - Gold ₹2000 per deposition till 100 nm thickness
01 - Other Academia - Titanium ₹1000 per deposition till 200 nm
03 - Industry partner - Titanium ₹1500 per deposition till 200 nm